The advantages of laser
- Allows point by point adjustment of the power needed for soldering; the lack of thermal inertia of the laser combined with real-time temperature readings, enable the dynamic correction of the thermal profile.
- Allows point by point adjustment of the power needed for soldering; the lack of thermal inertia of the laser combined with real-time temperature readings, enable the dynamic correction of the thermal profile.
- The orthogonal position improves the energy transferm The donut beam allows to radiate energy only on the pad and not on the hole, preventing damages to components and harmonizing the temperature of pin and pad.
- The ability to apply all of the energy in a single point makes this technology applicable in all those situations where it is not admissible to heat the whole board, or where there is limited access.
- Changing from “Lead” to “Lead-Free” soldering is simply a matter of changing a spool of solder wire.
- The laser soldering process is clean, which eliminates the need to clean, and subsequently handle, the processed boards, and the power consumption of the Firefly is extremely low compared to other types of soldering technologies.
- The Firefly systems are ready to solder as soon as they are switched on, without preheating, making them an extremely flexible tool in a manufacturing environment.
Diverse Solutions
The soldering head, which is the core of the system, is common to both the Firefly Next Series B60 and T60 Next Series machine configurations. The two solutions are characterized mainly by the side of the board where processing is performed: the BOTTOM solution, where the soldering process is carried out from below the PCB, and a TOP solution, where the soldering process is carried out from above the printed circuit board. This configuration is particularly suitable for automated processes where the system is integrated into an existing conveyor line.
The Firefly Next Series soldering systems can be successfully integrated into high-volume production lines, as well as in those cases where the products to be soldered are continuously changing and Lead” and “Lead-free processes are often mixed.
Process traceability
Process traceability is ensured by the possibility to collect the video recording and thermal profiles acquired for every solder joint, and to associate them to the serial number of the printed circuit board. The collection of this data is also valuable as a debug tool of the soldering process.
Environment-friendly
With a maximum power absorption of 2.5 KW/h, the Fireflyfly Next Series is easy to manage and maintain. In addition, the utilization of flux-based soldering alloys eliminates the need to use external fluxing stations, as well as the necessity for nitrogen. The consumption of solder alloy is limited to the amount applied to each joint, generating zero waste and eliminating disposal costs.
LASER UNIT
Laser Unit |
Solid State Diode |
Power |
30,60 W |
Laser Donut Spot size |
from 0.2 mm to 1.8 ID, from 0.5 mm. 4 mm OD |
Life time |
20000 hrs (at maximum power) |
Laser Resolution |
1 μm |
WIRE FEEDER
Wire diameter - standard |
0.75 mm |
Wire diameter options |
from 0.5 mm to 1mm |
Spool |
½ kg max. |
Wire speed |
from min. 1 mm/s to max. 20 mm/s |
Resolution |
10 μm |
Wire feeding controlled |
|
Tin Cutter |
|
TEMPERATURE SENSOR
Technology |
infrared pyrometer |
Acquisition range |
10 ms |
BOARD HANDLING CHARACTERISTICS
Dimensions (min.) |
40 mm x 60 mm |
Dimensions (max.) |
508 mm x 406 mm |
Board thickness (max.) |
5 mm |
Weight (max.) |
8 kg (manual loading) / 3 kg (automatic loading) |
Edge Clearance for transportationon belts (min.) |
3 mm per side |
Soldering side clearance (max.) |
35 mm |
Not soldering side clearance (max.) |
45 mm |
Maximum pin height (max.) |
3 mm |
Load/Unload speed |
5 to 30 m/min |
Time cycle |
~ 6 s |
Board Alignment Automatic |
(fiducial optical recognition) |
Interface |
SMEMA |
AXES MOTION
X Y AxesSpeed 1 m/s |
Repeatability ±25 μm Resolution 2,5 μm |
Z AxisSpeed 1m/s |
Repeatability ±10 μm Resolution 1 μm |
W Axis Speed 30°/s |
Rotation from 0° to 255°Resolution. 0.1° |
PRODUCTIVITY
Solder time per joint |
from 0.8 s to 1.2 s |
POWER SUPPLY AND CONSUMPTION
Input voltage |
230 V -10% +15% |
Power consumption (max.) |
2500 W |
Air consumption |
10 l/min to 6 Atm |
Fume extraction requirement |
30 m³/hr |
FUME EXTRACTION HOSE DIAMETER: 70 MM
ENVIRONMENTAL OPERATING CONDITIONS
Temperature |
18° to 35° C |
Humidity |
from 30 to 80% |
Floor surface planarity |
5 mm/m |
Altitude |
<4000 m. |
DIMENSIONS
Lenght |
1280 mm |
Width |
1500 mm |
Height |
1450 mm |
Height with Lamp tree |
1650 mm |
WARPAGE RECOVERY SENSOR (OPTION)
Sensor type |
Laser |
Measurement range |
±5 mm |
Measurement repeatability |
2 μm |
CAMERA
Connection |
GigE |
Resolution |
5Mpx |
Frame rate |
14fps |
Type |
Colour |
Pixel Resolution |
4.4 um |