The X#-platform series is an inline automated X-ray system which covers a wide range of AXI applications. It is a flexible platform with very versatile fields of use depending on the application requirements. The inspectable applications range from component level inspection for wire bonds, large SMT boards, high-power electronic modules up to fully assembled modules.
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Advanced battery form factors require smart inspection techniques for:
MatriX‘ fully automatic CT capturing and resulting 3D-slice-analysis lifts that task from the lab to the actual production floor. Enabling real time process control with automised feedback loops.
Sensor X-ray inspection is mainly covered from the SMT solder-joint algorithm library. In respect of voiding in the sensor joint area – a dedicated advanced void algorithm is available. For wire-bond inspection the semi-back end algorithm library can be used. Sensor inspection in multi-panel board condition can be inspected with the standard SMT setup in alls MXI and AXI systems. De-panelized sensor components are inspectable in trays as well. For such application a specific component in tray handling is available (X3S).
Typical LED Inspection Coverage:
Automatic 2D X-ray and CT inspection of critical medical parts such as screws, nails and other implants.
Inspection coverage (extract):
Based on the actual task the most suitable imaging technique can be selected out of MatriX‘ complete image capturing portfolio.
Analysing voiding and soldered area of assembled power devices and cooling plates. Special solder-level separation technique for multi-layer soldering applications (hybrid-power components).
Inspection Coverage (extract):
Requires high power setup and 16 Bit detector technology for heavy cooling plates. By using the MatriX SFT Technology. inhomogeneous backgrounds and disturbing structures are eliminated, thus assuring a correct void calculation.
Wetting coverage of Pin-Through-Hole (PTH) connections is an essential test of post-wave and/or post-selective soldering processes. In conjunction with MatriX‘ 2.5D oblique-view image capturing techniques and best in class THT/PTH algorithm library, a tailored high-speed solution can be provided.
Inspection Coverage (extract):
For automotive applications typically 100% inspection for all PTH required.
Various sensor AXI applications are available from MatriX with dedicated inspection algorithms. Especially in the automotive and aerospace area critical sensors have to be 100% inspected and therefore high-speed AXI is required with cycle-times less then 5s (3s) per sensor. Currently 2 different system setups are available: Sensor in tray setup (X2.5#, X3S) and dedicated integrated inline solutions with customized sensor holders and the capability to rotate the sensor for different angle-shots.
Available standard solutions:
Airbag-initiator inspection coverage:
Pressure-sensors (ABS) inspection coverage:
Customized solutions upon request.
X-ray inspection for solder joint analysis is an integral part in quality control of today’s electronic production. Especially packages like BGA and QFN, processed with hidden solder joints, require X-ray solutions to ensure product quality.
Inspection Coverage (extract):
Therefore MatriX offers a comprehensive algorithm library for state of the art defect recognition throughout all SMT capable system types.
MatriX high speed AXI can typically be used for 100% test-coverage (all components) inspection or for selective parts only (BGA,QFN) in on-line or off-line setups.
Combined Inspection Technologies: Transmission (2D), 2.5D and/or 3D technique
Components range from power transmission through interior trim to electronics. Materials may be metallic or non-metallic, but in either case MatriX’s experience in the sector is to assist the demand of manufacturers in:
