Semiconductor Monitoring Burn-in Test Chamber

ETSP-BTC series are Semiconductor Monitoring Burn-In test chambers to stress semiconductor packaged devices to ensure optimum performance as well as to weed out defective semiconductor packaged devices which can cause reliability problems in the end product.

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Uniform high accurate and reliable temperature control
Easy of operation and simplicity
Friendly, flexible, up-to date control and management systems
Allows easy servicing and upgrades
Selectable between manual door type (BTC 1000) and automatic door type (BTC 2000)
Computer control is available
Network connection of several chambers to a single "master" control unit allowing centralized supervision both in local and remote mode

Temperature range	40 ℃ ~ 150 ℃ (changeable according to user's demand)
Temperature uniformity	Less than ± 0.5 ℃
Temperature rising time	RT to 125 ℃ less than 50 minutes
Temperature cooling time	125 ℃ to RT less than 50 minutes
Cool-down rate	More than 1~5 ℃/min
Input power requirements	230V ±10%, 380V ±10%, 50Hz/60Hz, 1Ph/3Ph

Model	Internal dimensions	External dimensions	Note
ETSP-BTC 1000	1250x650x1300 (WxDxH) mm	2250x1500x2500 (WxDxH) mm	Manual door
ETSP-BTC 2000	1250x1500x2500 (WxDxH) mm	1250x650x1300 (WxDxH) mm	Automatic door

Chart recorder
T/C (Thermal couple) data acquisition (8, 16, 24, 32 Ch)
Chamber networking connection system (RS422/RS485)
Customization available

ETSP BTC Series Sinerji Catalog