TD Series offline dispensing systme is applicable for underfill, LENS dispensing, FPC package, SMT red glue dispensing, solder paste dispensing, LED package, fingerprint identification module, etc. for SMT & PCB assembly, semiconductor package, electromechanical assembly and flat-panel-display assembly.

TD-250D model is 250 x 300 mm with dual platforms offering solution including potting, sealing, gasketing and structual adhesives.

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