TD Series offline dispensing systme is applicable for underfill, LENS dispensing, FPC package, SMT red glue dispensing, solder paste dispensing, LED package, fingerprint identification module, etc. for SMT & PCB assembly, semiconductor package, electromechanical assembly and flat-panel-display assembly.
TD-250D model is 250 x 300 mm with dual platforms offering solution including potting, sealing, gasketing and structual adhesives.
You can use our Whatsapp support line to get information.