TD-300 Dispenser Machine

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TD Series offline dispensing system is applicable for underfill, LENS dispensing, FPC package, SMT red glue dispensing, solder paste dispensing, LED package, fingerprint identification module, etc. for SMT & PCB assembly, semiconductor package, electromechanical assembly and flat-panel-display assembly.

TD-300 model is 300 x 300 mm with single platform offering solutions including potting, sealing, gasketing and structual adhesives.

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Board Handling

Standard Work Area

X 300 × Y 300 x Z 70 mm

(X 11.81" × Y 11.81" x Z 2.95")
Maximum Components Height ± 30 mm (1.18") from PCB
Acceleration 0.5 g
Operation Height Level 950 ± 20 mm (37.40" ± 0.79")
Fluid Level Sensor Automatic monitor
Intelligent Automatic Nozzle Cleaner Non-contact vacumm nozzle cleaning

Transmission System

Motor X-Y linear modular and Z servo motor
Maximum Speed 1000 mm/s
Accuracy  ± 0.02 mm (± 0.0007")
Repeatability < 0.001 mm (< 0.0004")

Vision System

Resolution 1296 x 966 px
Pixel Size

3.75 x 3.75 μm
Light Source LED coaxial light source and ring light source

Facility

Standard Footprint

L 643 × W 487 × H 912 mm
Weight 80 kg
Motor Power DC 24 V 69 W × 2
Input Power AC 220 V 50/60 Hz 1 Phase
Total Power 2.2 KW

Interface

Controller IPC and motion controal card 
Software Anda user interface with Windows OS
Programming  On-line vision programming
Communications Protocol SMEMA
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