AD-16 Series

AD-16 Series fluid dispensing system is application for SMT underfill, encapsulation, LTS, TIM, flux, semiconductor package, wafer bond etc.

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Heated valves for viscosity control
35 degree tilt and 360 degree rotation
PCB heater enhances material flow for underfill applications
Precision weight measurement ensures accurate volumetric dispensing
Multiple valves available: Pneumatic jet valve, Slide valve and Screw valve
Laser height detection to calibrate Z axis automatically for component deformation
Dual valves

Board Handling

Standard Work Area	Single valve X 400 × Y 500 x Z 30 mm (X 15.75" × Y 19.68" x Z 1.18") Dual valve X 340 × Y 500 x Z 30 mm (X 13.39" × Y 19.68" x Z 1.18")
Maximum Components Height	± 30 mm (1.18") from PCB
Acceleration	2 g
PCB Edge Clearance	≥ 3 mm (≥ 0.12")
PCB Clearance Topside	30 mm (1.18")
Maximum Conveyor Width	400 mm (15.75")
Minimum Conveyor Width	60 mm (2.36")
Fluid Volume	30 cc
Fluid Level Sensor	Automatic monitor
Intelligent Automatic Nozzle Cleaner	Non-contact vacumm nozzle cleaning

Transmission System

Vision System

Resolution	1296 x 966 px
Pixel Size	3.75 x 3.75 μm
Light Source	LED coaxial light source and ring light source

XYZ Axis Configuration

Number of Valves	Single valve (Optional : Dual valves)
Motor	X-Y linear module and Z sero motor
Maximum Speed	1200 mm/s
Accuracy	0.025 mm (0.001")
Repeatability	± 0.01 mm (± 0.0004")

Facility

Interface

Controller	IPC and motion controal card
Software	Anda user interface with Windows OS
Programming	On-line vision programming
Communications Protocol	SMEMA