Saki's new 3rd generation AOI systems don't just inspect, they measure the height of all parts on the PCB and provide clear side-view images of the ICs and all devices on the board, significantly improving inspection capabilities over 2D technology. Saki's unique Phase Measurement Profilometry technology provides the 3rd dimension of the Z axis. Using quad-directional side cameras, the BF-3Di Series inspects QFNs, J-leads, and connectors, and enables the detection of the most difficult defects, such as lifted leads, tombstones, reverses, and height variations, without a reduction in speed.

The BF-3Di system incorporates the leading technology and functionality of Saki's 2D systems, such as its patented coaxial top-light illumination and extra component detection (ECD), to achieve seamless 3D imaging and reliable inspection, regardless of board and component colors. 2D technologies provide accurate and reliable polarity detection, character recognition (OCR/OCV), bridge detection, and alignment inspection, which are difficult to inspect with 3D imaging technology. Combining the strength of Saki's unique technologies maximizes automatic inspection coverage, utilization, and return-on-investment.