Saki's BF-3Si is one of the world's fastest 2-projector solder paste inspection systems while Saki's Phase Measurement Profilometry with Liquid Crystal on Silicon (LCoS) technology ensures high repeatability of inspection results. Saki's 3D SPI system inspects for: Height, volume, area, bridging, offset, shape. 

Solder paste inspection combines full-color 2D and 3D images and is based on 3D data. The condition of the solder paste is measured and automatically judged in 3D for each pad using Saki's proprietary height measurement technology, Phase Measurement Profilometry with LCoS. Saki's active projection technology projects various lighting patterns to measure all items on a substrate with a height range of 0-500 microns. By switching projection patterns at high speed, in real time, and combining both a narrow and wide range of measurement, Saki's BF-3Si realizes broad dynamic ranges. 

Saki 's unique, state-of the-art 3D measurement technology provides advanced analysis capability, with easy and powerful image-viewing features that allow the user to rotate, enlarge, and reduce images. The system automatically measures warpage at various points across a broad area of the board and optimizes the settings based on the warpage and the printed solder paste thickness to provide the greatest accuracy in warpage measurement and compensation. Program generation is via CAD data. Saki's BF-3Si SPI system also features a high-rigidity gantry for a very solid, accurate, and reliable, high-speed imaging system.