The XS-platform series is a small-footprint high-resolution automated X-ray inspection system concept designed for sophisticated high-speed inspection of semiconductor samples, wire bonds and PCB-assembly boards for single/multipanels or samples in trays. The inspectable applications range from component level inspection to mid-sized SMT boards.
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Sensor X-ray inspection is mainly covered from the SMT solder-joint algorithm library. In respect of voiding in the sensor joint area – a dedicated advanced void algorithm is available. For wire-bond inspection the semi-back end algorithm library can be used. Sensor inspection in multi-panel board condition can be inspected with the standard SMT setup in alls MXI and AXI systems. De-panelized sensor components are inspectable in trays as well. For such application a specific component in tray handling is available (X3S).
Typical LED Inspection Coverage:
Analysing voiding and soldered area of assembled power devices and cooling plates. Special solder-level separation technique for multi-layer soldering applications (hybrid-power components).
Inspection Coverage (extract):
Requires high power setup and 16 Bit detector technology for heavy cooling plates. By using the MatriX SFT Technology. inhomogeneous backgrounds and disturbing structures are eliminated, thus assuring a correct void calculation.
Wetting coverage of Pin-Through-Hole (PTH) connections is an essential test of post-wave and/or post-selective soldering processes. In conjunction with MatriX‘ 2.5D oblique-view image capturing techniques and best in class THT/PTH algorithm library, a tailored high-speed solution can be provided.
Inspection Coverage (extract):
For automotive applications typically 100% inspection for all PTH required.
Various sensor AXI applications are available from MatriX with dedicated inspection algorithms. Especially in the automotive and aerospace area critical sensors have to be 100% inspected and therefore high-speed AXI is required with cycle-times less then 5s (3s) per sensor. Currently 2 different system setups are available: Sensor in tray setup (X2.5#, X3S) and dedicated integrated inline solutions with customized sensor holders and the capability to rotate the sensor for different angle-shots.
Available standard solutions:
Airbag-initiator inspection coverage:
Pressure-sensors (ABS) inspection coverage:
Customized solutions upon request.
X-ray inspection for solder joint analysis is an integral part in quality control of today’s electronic production. Especially packages like BGA and QFN, processed with hidden solder joints, require X-ray solutions to ensure product quality.
Inspection Coverage (extract):
Therefore MatriX offers a comprehensive algorithm library for state of the art defect recognition throughout all SMT capable system types.
MatriX high speed AXI can typically be used for 100% test-coverage (all components) inspection or for selective parts only (BGA,QFN) in on-line or off-line setups.
Combined Inspection Technologies: Transmission (2D), 2.5D and/or 3D technique
