The X-platform series is a dedicated high speed inline automated X-ray inspection system for the inspection of PCB-assembly boards for single/multipanels or samples in trays. The system offers market leading inspection speed and is ideal for low-mix high-volume production environment.
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Analysing voiding and soldered area of assembled power devices and cooling plates. Special solder-level separation technique for multi-layer soldering applications (hybrid-power components).
Inspection Coverage (extract):
Requires high power setup and 16 Bit detector technology for heavy cooling plates. By using the MatriX SFT Technology. inhomogeneous backgrounds and disturbing structures are eliminated, thus assuring a correct void calculation.
Wetting coverage of Pin-Through-Hole (PTH) connections is an essential test of post-wave and/or post-selective soldering processes. In conjunction with MatriX‘ 2.5D oblique-view image capturing techniques and best in class THT/PTH algorithm library, a tailored high-speed solution can be provided.
Inspection Coverage (extract):
For automotive applications typically 100% inspection for all PTH required.
X-ray inspection for solder joint analysis is an integral part in quality control of today’s electronic production. Especially packages like BGA and QFN, processed with hidden solder joints, require X-ray solutions to ensure product quality.
Inspection Coverage (extract):
Therefore MatriX offers a comprehensive algorithm library for state of the art defect recognition throughout all SMT capable system types.
MatriX high speed AXI can typically be used for 100% test-coverage (all components) inspection or for selective parts only (BGA,QFN) in on-line or off-line setups.
Combined Inspection Technologies: Transmission (2D), 2.5D and/or 3D technique
