Application of 1C63 Silicone Conformal Coating

Conformal coatings can be successfully applied to substrates that have been cleaned prior to coating and also to substrates assembled with low residue “no clean” materials. Users should perform adequate testing to confirm compatibility between the conformal coating and their particular assembly materials, process conditions and cleanliness level. Please contact a HumiSeal representative for additional information.

1C63 is designed for application without additional thinning. Solvents or other thinners should not be mixed with 1C63. 1C63 may be applied by spray, brushing, flow coating or dipping. The time required to reach a tack-free state is dependent on ambient conditions such as temperature and relative humidity. The processing guidelines contained in this document were obtained with an ambient relative humidity of 50%.

Spraying

HumiSeal® 1C63 may be applied using conventional spraying equipment. Spraying should be done in an environment with adequate ventilation so that the vapor and mist are carried away from the operator. The use of thinner is not required or recommended for HumiSeal® 1C63.

Brushing

Uniformity of the film depends on component density and operator’s technique.

Curing

HumiSeal® 1C63 is a highly cross-linked coating. In order to achieve maximum cross-linking density, the product must be exposed to the correct spectral output. The table below outlines the required dosage and irradiance values necessary to properly cure HumiSeal® 1C63. After UV exposure and return to room temperature, the coating should be tack free.

HumiSeal® 1C63 was designed to be cured using a microwave UV oven equipped with an “H” style bulb. Arc systems can cure HumiSeal® 1C63 however care must be taken during the equipment selection process to ensure minimum dosage and irradiance values can be obtained. Due to the variations possible in curing equipment type and configuration, it is strongly recommended that you contact HumiSeal® Technical Support to discuss your equipment and process in detail.