Application of UV40-250 Conformal Coating
Conformal coatings can be successfully applied to substrates that have been cleaned prior to coating and also to substrates assembled with low residue, “no clean” assembly materials. Users should perform adequate testing to confirm compatibility between the conformal coating and their particular assembly materials, process conditions and cleanliness level. Please contact HumiSeal® for additional information.
Spraying
HumiSeal® UV40-250 can be applied via standard selective coating equipment or by conventional hand spray equipment. The source air used for spraying must be dry (a dry inert gas is highly recommended) to prevent premature curing of the secondary cure mechanism. The spraying should be done with adequate ventilation so that the vapor and mist are carried away from the operator.
Brushing
HumiSeal® UV40-250 may be applied by brush for rework or touch up only. Brush must be cleaned with solvent promptly after use.
Clean Up
To flush equipment and clean uncured HumiSeal® UV40-250, non-alcohol-based solvents should be used. HumiSeal® Thinner 521 or Thinner 521EU is recommended.
Rework
HumiSeal® UV40-250 is a highly cross-linked UV cured coating. The cured film has a high degree of environmental and chemical resistance and will be more difficult to remove than traditional conformal coatings. Thermal displacement, mechanical abrasion and, where available, HumiSeal® Stripper 1100 are suitable options for rework of HumiSeal® UV40-250.
|
1.06 g/cm3 |
|
95 % |
- Viscosity, per Fed-Std-141, Meth. 4287
|
300 ± 50 centipoise |
- Recommended Coating Thickness
|
25 – 125 microns |
|
see curing section above |
- Shelf Life at Room Temperature, DOM
|
6 months |
|
HumiSeal® Stripper 1100 |
- Thermal Shock, 50 cycles per MIL-I-46058C
|
-65°C to 125°C |
- Glass Transition Temperature – DSC
|
26°C |
- Coefficient of Thermal Expansion
|
112 ppm/°C Below Tg 283 ppm/°C Above Tg |
|
1060 MPa -60°C |
|
V-0 |
- Dielectric Withstand Voltage, per MIL-I-46058C
|
>1500 volts |
- Dielectric Constant, at 1MHz and 25°C per ASTM D150-98
|
2.41 |
- Dissipation Factor, at 1MHz and 25°C per ASTM D150-98
|
0.01 |
- Insulation Resistance, per MIL-I-46058C
|
8.0 x 1014 ohms (800TΩ) |
- Moisture Insulation Resistance, per MIL-I-46058C
|
4.7 x 1010 ohms (47GΩ) |
- Fungus Resistance, per ASTM G21
|
Pass |
|
Excellent |