The SP700 becomes the SP710 when it is equipped with the optional Automatic Dispense unit (ADu).
With one micron solid state linear encoders, the SP710’s accuracy is astounding. The ADu can be fitted with any combination of paste and glue module, allowing you to cover all applications.
The SP710 SMT screen printer combines Speedprint’s commitment to high performance and reliability with outstanding value. The system has been designed to cope with the rigors of high volume SMT production while incorporating the flexibility needed in high-mix, quick product set-up & changeover environments.
Designed with ease of use & low cost of ownership in mind, the system utilises the most advanced drive control technology available, including 1 micron resolution Linear encoders on all axes, together with a suite of intuitive software that enables total control of the printing process.
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SP700 series is fully equipped, as standard, with many features such as automatic rail width adjust, fully auto stencil loading and a fully programmable Under Stencil Cleaner. This is a highly efficient and fully programmable standard feature of the SP700 series.It may be programmed to be run wet or dry in any combination.
Incorporating an advanced user interface running on the latest Windows operating system, the SP700 series also provides comprehensive self diagnostic capabilities, such as production logging and automatic fault report generation, which enables “on the fly” troubleshooting.
Speedprint utilises a unique twin roving camera ‘look down – look down’ method of automatic vision alignment. This innovative vision system gives Speedprint users the unique capability of checking for solder paste presence on the stencil before printing. The vision system aligns the PCB with the stencil using fiducial marks and/or PCB/Stencil features.
The precision machined print head features closed loop squeegee control as standard, with fully programmable print parameters.
Adding to the flexibility of the SP700 platform is the standard capability to process ultra thin PCBs down to 0.2mm. This is achieved through installation of the UTC System which enables the substrate to be clamped top and bottom with equalised pressure and independently of the drive belts, thus producing zero distortion of the substrate and maintaining optimum process control.
