Steam aging chamber is designed for artificial aging of all electronic components and circuit boards. This includes high density discrete components, relays, transistors, capacitors, SMT, and axial components. Artificial steam aging of components must occur over a very narrow temperature range, typically at 93 C +/- 5 degrees. ETSP-STH series   are the only systems currently on the market that meet this precise control requirement. This thermal accuracy makes ETSP-STH  series ideal for component manufacturers and military, commercial, and industrial end users.