In order to meet all requirements in terms of flexibility, the third generation VERSAFLOW has been created as a modular platform. The VERSAFLOW 3/66 belongs to this generation of machines and is especially designed for the selective soldering of PCBs in “XL” format. PCBs with dimensions of up to 610 mm x 610 mm pose no problem for this modern soldering system.

Both preheating and solder modules with single wave pots can be additionally equipped with top-side heating systems. Thanks to the dual-track option, the throughput rate can be doubled without increasing the footprint of the machine.

If the size of the assembly also allows segmentation of the preheating modules, a further increase in throughput is possible. These options enable the Versaflow 3/66 to achieve extremely short amortization periods and offer the highest throughput rates currently available in the market of selective soldering systems, coupled with maximum flexibility in electronics assembly manufacturing.