Solder Paste Printing Process Seminar

Sinerji Academy Presents
Solder Paste Printing Process Seminar
2 October 2025

Sinerji Academy hosted a comprehensive technical seminar addressing the critical factors affecting quality in soldering and printing processes. Organized with the participation of AIM Solder, Europlacer (Speedprint), and industry expert Keith Bryant, the two-day program provided electronics manufacturing professionals with both practical and technical insights.

Academy Course Details

February 10 – 11, 2025 | Istanbul

The seminar examined key topics in detail, including low-temperature and low-voiding solder pastes, their advantages, and results from field applications. Furthermore, advancements in printer software and hardware technologies, as well as the benefits and challenges of closed-loop printing technology, were discussed.

Throughout the program, sessions focused on low-temperature soldering performance, methods for increasing process efficiency, the importance of process and stencil cleaning, step stencil techniques, and solution-oriented approaches to common printing challenges. Technical presentations by AIM and Europlacer representatives allowed participants to analyze real-world production issues and evaluate methods for process optimization.

We would like to thank all the participants and experts who joined us for this productive event, where the latest technologies in printing and soldering were shared.