2Di-LU1
A 2D bottom-side inspection machine is engineered to automate the final inspection stages of PCB mounting. This Bottom-Side AOI system ensures the solder quality of through-hole components following selective, flow, and dip soldering processes. Since manual board handling and PCB reversal are no longer required, operational efficiency is significantly enhanced.
Efficiency
The equipment design is optimized to accommodate the mounting of large components.
Common operations with SMT process
High-speed Inspection
Full-board imaging enables rapid inspection across the entire assembly. This is achieved through SAKI’s specialized line scan imaging method.
Solder Detection
THT solder inspection identifies various solder defects concurrently. The system also features Extra Component Detection (ECD) inspection capability.
| Model | 2Di-LU1 |
|---|---|
| Size (W)×(D)×(H)mm (in.) | 1040×1440×1500 (40.94 x 56.69 x 59.06) |
| Resolution | 18μm |
| PCB Clearance | Top: 130mm (1.57 in.) Bottom: 40mm (2.36 in.) |
| Electric Power Requirement | Single-phase ~ 200-240V +/-10%, 50/60Hz, 700VA |
| Weight | Aprox. 750kg |
| PCB Size (W)×(L)mm (in.) | Carrier：50 x 60 – 610 x 610 (1.97 x 2.36 – 24.02 x 24.02) Inspection area (Scan)：50 x 60 – 460 x 500 (1.97 x 2.36 – 18.11 x 19.69) |
| PCB Weight | 12kg or less |
This product video introduces 2Di-LU1 by summarizing its general working principle and typical application scenarios.
English 
Türkçe