The 3D-CT AXI is a high-speed and high-precision 3D-CT X-ray inspection system, compatible with SMT, through-hole processes, and semiconductor inspection processes. This system provides the industry’s fastest speed, utilizing superior 3D imaging and inspection quality to detect a full spectrum of solder defects on PCBs.

The 3D-CT AXI range includes high-definition models and high-power, high-speed models designed to meet various inspection requirements.

Powerful High-Speed, High-Definition Imaging

• The industry’s fastest imaging and calculation processing capability.

• Detailed and true 3D image generation to support zero-defect production.

• Supports the inspection of slim and lightweight DSC power modules.

Ease of Use and Reduced Workload

• Automatic imaging condition settings are easy to program and can be synchronized from AOI.

• Debugging can be performed without stopping the production line.

Improved Maintainability and Ease of Maintenance

• Long-life hardware design ensures consistently high accuracy.

• Integrated self-diagnostic function featuring exposure dose prediction and reduction.