Versaprint 2 Elite Plus

Stencil Printer and SPI combined for maximum efficiency

Versaprint 2 Elite Plus

Suitable printer for line production when 100% inspection is not required

The Ersa VERSAPRINT 2 ELITE PLUS stencil printer is an ideal solution for efficient line production where full 100% inspection is unnecessary, such as when an SPI system is already integrated. Designed for ease of use, it features a high-performance area scan camera with dual camera modules. With advanced multi-type illumination, even complex or low-contrast structures on the substrate are accurately detected, ensuring consistent printing quality and reliability in demanding production environments.

Stencil printer with fully integrated solder paste inspection
Stencil printer with fully integrated solder paste inspection

Almost 70% of all process errors in SMT lines are associated with the stencil printing stage. Many of these errors can be eliminated in a cost-efficient way. The Ersa VERSAPRINT 2 printer series is equipped with modern camera technologies that enable fast setup and full-area solder paste inspection directly within the printer. The intuitive user interface supports space-saving operation. With the concept of “features on demand”, VERSAPRINT 2 can be flexibly adapted to meet specific application requirements.

2D-SPI directly after the printing process
2D-SPI directly after the printing process

• LIST camera enabling 100% inspection within the process cycle
• Low space requirement in the production line for printing and inspection
• Closed-loop process control for stencil printing and post-print inspection
• Simple programming and operation
• Stencil printing and SPI combined in one machine

3D SPI for inspecting complex boards
3D SPI for inspecting complex boards

• VERSAPRINT stencil inspection identifies errors before they occur
• Zero-point measurement of the unprinted LP at any time before printing
• Integrated closed-loop function for print offset control
• Integrated software platform for printing and inspection
• Maintenance and servicing for one machine and one AP covering both processes

Pneumatical squeegee clamping and adjustable stencil support for optimal performance
Pneumatical squeegee clamping and adjustable stencil support for optimal performance

Proven over-top clamping mechanism for reliable operation
Proven over-top clamping mechanism for reliable operation

Stencil bottom cleaner and surface camera
Stencil bottom cleaner and surface camera

Advanced 3D Inspection and Visualization
Advanced 3D Inspection and Visualization

During 3D inspection, VERSAPRINT 2 analyzes solder paste print parameters such as volume, area, height, short, and offset. When deviations from defined specifications are detected, the system additionally records a 2D image of the affected area, enabling clearer visualization and more effective analysis by the operator. For detailed examination, the operator can rotate and zoom the detected defect in the 3D image as needed. Height profiles are displayed using color coding, where borderline regions are marked in yellow and red. A critical factor in height measurement is the correct definition of the zero point. Since the pad area used as the zero reference is covered with solder paste during measurement, common SPI practice requires measuring a limited number of unprinted boards before production to establish this reference. This procedure typically needs to be repeated when changing batches or suppliers.

Integrated Pre-Inspection and SPC-Based Process Optimization
Integrated Pre-Inspection and SPC-Based Process Optimization

An essential advantage of the integrated inspection within the printer is the ability to measure every PCB prior to printing. If particularly high accuracy is required, or if sufficient cycle time is available, the system can consistently perform a pre-inspection. Statistical Process Control (SPC) serves as a key instrument for ongoing process optimization. The SPC function integrated in VERSAPRINT 2 gathers all relevant process data, including inspection results, summarizes the information clearly, and visualizes trends. This data can be used directly at the machine for immediate process adjustment, for end-of-line comparison with AOI systems, or as a monitoring tool for production management.

Technical Specification
Feature Versaprint 2 Elite Plus
Substrate size (X x Y) min. 50 x 50 mm, max. 680 x 500 mm (test area 550 x 500 mm)
Optional stencil cleaner 680 x 500 mm
Substrate thickness 0.5-6 mm
Component clearance up to 35 mm
Stencil size min. 450 x 450 mm, max. 737 x 737 mm adjustable without tools
Print head two independent squeegee heads with continuous squeegee force control, squeegee depth stop and oscillation limiter
Squeegee force 0-230 N
Camera 3D line scan camera for alignment and inspection of substrate and stencil
Repeat accuracy +/-12.5 µm @ 6 Sigma
Print accuracy +/-25 µm @ 6 sigma
Cycle time 10 s + print
Setup time under 10 min
Product changeover under 2 min
Graphical user interface touchscreen
Product Brochure of Versaprint 2

Download the product brochure of Versaprint 2 series to learn about its key features, technical structure, and application areas

Product Video
Versaprint 2 Series

This product video introduces Versaprint 2 Series by summarizing its general working principle and typical application scenarios.