May 06 – 07, 2025 | Istanbul

Within the scope of the seminar, industry experts Mr. Keith Bryant and Mr. Anusorn from Saki shared technical insights into modern inspection processes. Over two days, critical topics such as illumination-based image processing, 3D height measurement principles, 2D and 3D AOI/SPI inspection techniques, THT and conformal coating evaluation, inline X-Ray imaging of hidden solder joints, and automated final product inspection were examined.

One of the most notable parts of the event was the analysis of real-world manufacturing defect samples. Together with the participants, solution-oriented approaches to prevent quality issues were discussed through visual examples of SPI defects, including component height variations, excess solder, and bridging.

We would like to thank all our participants and valued experts who joined us for this program, organized in collaboration with Saki.