- An inspection and reporting application for boards with completed SMD placement, components requiring incoming quality control, and printed circuit board traces using specialized equipment such as X-Ray.
- Internal structures, soldering quality, and placement accuracy of components; especially BGA, QFN, and wound elements—are controlled with high precision under X-Ray.

- Wire Bonding Inspection: Intermetallic connection quality is measured with a Test Bonder device to prevent potential errors in ICs.
- Optical Inspection: Soldering quality and placement accuracy of the smallest components are analyzed using analog, digital, and mobile optical devices.

- Ensures quick and accurate detection of failures caused by BGA and QFN components.
- Provides cost savings by preventing the unnecessary removal of expensive materials and boards.
- Secures the quality control of processes performed at BGA rework stations using X-Ray machines.
- Allows for the early detection and correction of potential errors in integrated circuits (ICs).