3Di-LS3EX Ring Lighting / L
This 3D-AOI system offers full compatibility with SMT and through-hole processes, fulfilling all quality standards for sophisticated inspection tasks. It is designed to handle high-density printed circuit boards and assemblies featuring a combination of extremely small and tall components. The camera resolution and lighting configurations can be customized, ensuring the necessary flexibility for various production environments and product ranges.
Scalability
Several options are available, such as dome lighting, side cameras, and Z-axis control.
Conformal Coating Inspection (CCI) can be integrated through the UV lighting option.
Camera resolution settings are adjustable on-site.
Optimization of the production line
The creation of inspection programs is characterized by automation and efficiency.
It ensures seamless coordination between SAKI devices.
High accuracy and high speed
Smallest components are clearly identified through high-definition images.
Inspections are executed at the quickest speed possible.
| Model | 3Di-LS3EX |
|---|---|
| Dimensions | L |
| Size[Main body] (W) x (D) x (H) mm (in.) | 1040×1480×1500 (40.94 x 58.27 x 59.06) |
| Resolution | 8μm、15μm |
| PCB Clearance mm (in.) | Top: 40 (1.57) Bottom: 60 (2.36) *2 |
| Electric Power Requirement | Single-phase ~ 200-240V+/-10%, 50/60Hz |
| PCB Size （W）×（L）mm (in.) | 50 x 60 – 510 x 510 (1.97 x 2.36 – 20.07 x 20.07)*3 |
| Weight | 900kg |
| ! |
|---|
| *1 Imaging speed when equipped with a Z axis. The XL size comes standard with a Z axis. |
| *2 For dual mode, the PCB Clearance Bottom is 50mm (1.96 in.), |
| *3 For dual mode, the PCB Size is 50×60〜320×510 (1.97 x 2.36 – 12.60 x 20.07) |
| *4 An expansion to 60 inches (686 x 1524) is optional. |
This product video introduces 3Di-LS3EX by summarizing its general working principle and typical application scenarios.
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