3Si-LS3EX Ring Lighting / L
SAKI’s High-speed and high-precision 3D-SPI machines specialize in the inspection of SMT process solder printing. These 3D-SPI systems inspect and analyze various potential issues, including the measurement of solder paste area, height, and volume, as well as compliance for bridges, solder horns, and BGA coplanarity.
The quality of the complete production line is maintained through machine-2-machine (M2M) coordination involving solder printing and pick-and-place equipment.
High-Speed Inspection
High Accuracy Inspection
SAKI’s M2M Solution
| Model | 3Si-LS3EX |
|---|---|
| Dimensions | L |
| Size[Main body] (W) x (D) x (H) mm (in.) | 1040×1480×1500 (40.94 x 58.27 x 59.06) |
| Resolution | 8μm、15μm |
| PCB Clearance mm (in.) | Top: 40 (1.57) Bottom: 60 (2.36) *2 |
| Electric Power Requirement | Single-phase ~ 200-240V+/-10%, 50/60Hz |
| PCB Size （W）×（L）mm (in.) | 50 x 60 – 510 x 510 (1.97 x 2.36 – 20.07 x 20.07)*3 |
| Weight | 900kg |
| Inspection Item | the measurement of solder paste area, height, volume, bridge, solder horn, BGA coplanarity compliance |
| ! |
|---|
| *1 Imaging speed when equipped with a Z axis. The XL size comes standard with a Z axis. |
| *2 For dual mode, the PCB Clearance Bottom is 50mm (1.96 in.), |
| *3 For dual mode, the PCB Size is 50×60〜320×510 (1.97 x 2.36 – 12.60 x 20.07) |
| *4 An expansion to 60 inches (686 x 1524) is optional. |
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