MK 1809 Reflow Oven

The ISO-certified Heller MK7 reflow oven is an advanced reflow system designed with several groundbreaking engineering concepts. The system integrates multiple customer-driven requirements, including lower Delta T on the board, reduced nitrogen consumption, and extended product maintenance intervals, all within a low-height design that allows clear visibility across the production floor.

The MK7 offers a highly customizable configuration with nitrogen chamber air and vacuum options, enabling flexible integration into different production environments.

Highlights

  • Easy to maintain
  • Save 10–15% in energy loss
  • INDUSTRY 4.0 compatible reflow oven
  • Revolutionary green flux management system using a catalyst that produces no waste byproduct. This system enables flux removal while the reflow soldering oven is operating and eliminates the risk of flux clogging.
  • Low Delta T on the board
  • Integrated CPK software provided at no additional charge

New MK7 Reflow Oven for High-Throughput SMT and Semiconductor Applications
The MK7 reflow oven revolutionizes SMT and semiconductor production with innovative design and advanced engineering.
It integrates all key customer requests — including lower Delta T, reduced nitrogen usage, and extended preventive maintenance intervals — into a compact low-height system that ensures clear visibility across the production floor.
You’re invited to visit one of our three demo centers to run thermal profiles and collect data yourself to experience the MK7 reflow oven’s performance advantages. Alternatively, send us your most challenging PCB, and we will provide custom reflow soldering profiles and data tailored to your production needs.

Highest Yield and Efficiency!
✔ Lowest Delta T on the board
✔ Minimal nitrogen and power consumption
✔ Maintenance-free design
✔ VOID-free reflow process with vacuum option
✔ Industry 4.0 compatible system
✔ Integrated Cpk software – free of charge!

<h5>Reflow Oven with New Low-Height Top Shell</h5>
Reflow Oven with New Low-Height Top Shell

The low-height top shell provides easier access for operators. All exterior panels feature dual insulation, reducing reflow soldering energy loss by 10–15%.

Industry 4.0 Compatible Reflow Oven

Part of the Internet of Manufacturing (IoM) concept — enabling smart factories, intelligent systems, and connected production through cyber-physical integration.
The improved low-height heater module delivers optimal airflow and uniform heating with the lowest Delta Ts. The Uniform Gas Management system eliminates net flow, reducing nitrogen consumption by up to 40%. A new semi-circular heater design provides higher durability, greater efficiency, and a longer lifetime.

Revolutionary Flux Management System

The MK7 introduces a patented flux collection system that traps flux in removable jars — allowing maintenance during operation. The flux filtration box eliminates clogging risks, extending maintenance intervals. Additionally, the Flux-Free Grill system prevents residue buildup, ensuring maximum production yield and clean operation.

<h5>Green Flux Management – Low Temperature Catalyst</h5>
Green Flux Management – Low Temperature Catalyst

The integrated low-temperature catalyst system decomposes flux into harmless CO₂ and H₂O without producing any harmful byproducts. It requires no additional power or cooling, reducing operational costs. The catalyst also lowers oxygen concentration, which decreases nitrogen usage while maintaining target PPM levels. As a result, the oven remains cleaner for longer, extends PM intervals, and increases productivity.

Reflow Oven CPK System

A three-tiered control system (Tier 1: Reflow Oven CPK, Tier 2: Process CPK, Tier 3: Product Traceability) enables manufacturers to improve quality and yield while reducing costs. Automatic data recording and traceability ensure that all reflow soldering parameters remain under control and within specification.

<h5>Reflow Oven With Programmable Cooling</h5>
Reflow Oven With Programmable Cooling

<h5>Reflow Oven Energy Management Software</h5>
Reflow Oven Energy Management Software

Technical Features of MK 1809
Basic Data Features MK 1809
Length (mm) 4.650
Width (mm) 1.520
Height (mm) 1.440
Weight (kg)** 2.420
Power and N2
Features MK 1809
Power Inputs 208/240/380/400/415/440/480 VAC
Max Current Draw 100 Amp @ 480v
Continuous Power kW 7.5 - 16
N2 Supply Pressure (bar) 5 -7
N2 Operating Pressure (bar) 6
Typical N2 Consumption*** 500-700SCFH
Heating and Cooling
Features MK 1809
Heating Zones* 9
Heating Length (mm)* 2.560
Cooling Zones* 2
Cooling Length (mm)* 700
Max.Temp (°C)* 350
Resolution of Temp. Controller(°C) ±0.1
Profile Change Time (min) 5-15
PCB Support
Features MK 1809
Single Lane / MeshBelt* 50 - 560 , Option 50 - 610
Dual Lane in Single Lane Mode* 50 - 400, Option 50 - 450
Dual Lane in Dual Lane Mode* 50 - 225, Option 50 - 250
Dual Lane Rails* FMMM, FMMF, FMFM
PCB Direction L to R, R to L
PCB Top/Bottom Clearance (mm)* Meshbelt: Top 58 Chain: ±29 & ±35
Transportation Height (mm)* Mesh belt: 930+/-60 Chain: 960+/-60, Option 900+/-60
Conveyor Speed (mm/min)* 250 - 1,880
Length of PCB Support Pins 4.75
Auto Lubrication System S
Power Width Adjustment S
KIC Profiling Software S
Önemli Bilgiler
*Special option per requrest
**Oven weight varies upon actual configurations
***Varies with PPM, PCB size and oven configuration
S: Standard
! Please note specifications for air ovens and N2 ovens may vary, and specifications of the actual product may vary from those listed in this promotional brochure due to product improvements or technical updates. For the latest information, please contact us.
Product Brochure of MK7 Series

Download the product brochure of MK7 Series to learn about its key features, technical structure, and application areas

Product Video
MK7 Series

This product video introduces MK7 Series by summarizing its general working principle and typical application scenarios.