Spider
State-of-the-art technology that easily integrates into any production line. Delivers a wide range of precise dispensing applications including solder paste, SMT glue, LED encapsulation, silver epoxy, dam and fill, underfill, cavity fill, and advanced 3D dispensing with laser height mapping and more.
✔ Operates with up to two dispense valves simultaneously.
✔ Equipped with five different valve types for a wide range of applications.
✔ Exceptional valve performance reaching 1,100,000 dots per hour — system average of 350,000 dots/h.
✔ Capable of up to 2,000,000 dots/h in line mode.
✔ Occupies only 1 sqm of production floor space.
✔ Compact design fits easily through a 90 cm wide doorway.
✔ Symmetrical mineral casting eliminates vibration.
✔ No warpage or thermal drift ensures long-term precision.
✔ Laser technology maps height variations.
✔ Compensates for substrate warping and complex 3D contours.
✔ High-speed, reliable dual-drive linear motors.
✔ Maintenance-free design guarantees the longest service life.
The 21.5”, 16:9 HD wide touch screen features state-of-the-art, full graphics and provides intuitive fingertip operation. This comprehensive solution includes universal CAD conversion and a zoom function for camera windows. The software facilitates all-in-one job planning, setup optimisation, and stock management. Additionally, it allows for seamless ERP/MES connection, in-depth data analysis, and efficient line management.
For your optimal benefit, we have various product notes available for our optional equipment. Please contact your local consultant or our service team. Essemtec solutions are unique in the industry and characterized by fast and uncomplicated adaptation to general conditions and customer requirements.
Integrate into high speed lines and highly complex dispense applications. Two processes at the same time. Plug and Play for valve change. Piezo Jet Valve - super high speed for low viscosity. Solder Jet, Volume Displacement, Time/Pressure, Archimedean Screw Valve. Full operator support - Automated error analysis & KPI. Training, support and troubleshooting via advanced remote access. Investment protection; all options and heads retrofittable.
| Piezo Jet | Shockwave Jet | Volume | Screw | Time-Pressure |
|---|---|---|---|---|
| SMD-Adhesives, Underfill, Silver Epoxy, UV-Adhesives, Globe Top, Encapsulation, Dielectric Ink | Solder Paste, Liquid Metal | Underfill, Gasketing, Globe Top, Dam and Fill, Solder Paste | Solder Paste, SMD-Adhesive, Globe Top, Encapsulation, Silver Epoxy, Dam and Fill | Gasketing, Globe Top, Encapsulation, Solder Paste, SMD-Adhesive, Silver Epoxy, Dam and Fill |
| Low - High Viscosity | High Viscosity | Low - High Viscosity | High Viscosity | High Viscosity |
| Max Frequency: 2’000’000 dots/h BGA Jet-on-the-Fly: 780’000 dots/h BGA Stop & Jet: 177’000 dots/h | Max Frequency: 1’100’000 dots/h BGA Jet-on-the-Fly: 665’000 dots/h Average Speed: 350’000 dots/h | 26’000 dots/h (BGA Pattern*) | 30’000 dots/h (BGA Pattern*) | 38’000 dots/h (BGA Pattern*) |
This product video introduces Spider by summarizing its general working principle and typical application scenarios.