✔ Placement, solder paste and additional jet dispensing processes are integrated into one system
✔ A single, space-efficient platform designed to handle all processes

✔ Monitoring of dot size, volume and weight during jetting
✔ Adjustment of process parameters and stabilization of dispensing dots

✔ Reduced time to market / NPI / immediate repair capability
✔ Lower operational costs by eliminating the need for additional printers or stencils

✔ Compatible with different jettable pastes and various media
✔ Suitable for special applications (nozzle, tappet, etc.)

✔ Supports up to 4 placement axes and 3 dispensing processes
✔ Dot size range of 200–800 μm using the same valve

✔ Adaptable with needles for applications involving deep cavities
✔ Height mapping performed using laser technology

✔ Conversion of Gerber files and import of CAD data
✔ One-click production file generation

This non-contact jet valve is designed for dispensing solder pastes ranging from class 4 to 7, limited to jettable types. When integrated with a Pick-and-Place process on an Essemtec platform, it enables an All-In-One production approach, allowing complete PCB processing within a single machine and providing full production flexibility.