VIGON A 201
The MPC-based cleaning agent is specifically formulated for removing flux residues from both leaded and lead-free No-Clean solder pastes. After the cleaning process, it ensures shiny solder joints without requiring any additional additives.
This cleaning solution delivers high cleaning efficiency in spray-in-air systems, effectively penetrating and cleaning capillary spaces, such as areas beneath low standoff components.
This product video introduces VIGON A 201 by summarizing its general working principle and typical application scenarios.
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