The SAKI 3D-SPI facilitates enhanced production efficiency through exceptional speed, alongside improved product performance and precise takt-time control. This system is fully compatible with SMT and through-hole processes, meeting rigorous quality standards for complex inspection tasks, including high-density printed circuit boards and boards containing a combination of miniature and tall components.

3D-SPI

• High-accuracy, high-quality, and versatile solder print inspection.
• The fastest inline inspection speed available in the industry.
• M2M collaboration designed to achieve comprehensive line automation.

3D-AOI

• Inspection characterized by high precision and high speed.
• Optimized work efficiency regarding the creation of inspection programs.
• AI solutions implemented to reduce dependency on operator skill levels.

Advanced Software Solutions

• A unified user interface integrated across SPI, AOI, and AXI platforms.
• Improved operational efficiency for developing inspection programs.
• Production enhancement through AI solutions that refine inspection quality.