EXOS 10/26
The EXOS 10/26 is designed to meet the requirements of electronics manufacturing for non-porous solder joints, particularly in power electronics and high-reliability applications. This convection reflow soldering system features 22 heating chambers, 4 cooling zones, and a vacuum chamber positioned after the peak zone, enabling the void rate to be reduced by up to 99%.
With its intelligent features, the EXOS 10/26 supports highly economical production while enabling “void-free” soldering performance.
| Technical Specification | EXOS 10/26 |
|---|---|
| Length x width x height (Hotflow Three 16) | 5.65 x 1.77 x 1.62 m |
| Length x width x height (Hotflow Three 20) | 6.60 x 1.77 x 1.62 m |
| Length x width x height (Hotflow Three 26) | 7.73 x 1.77 x 1.62 m |
| Weight | 3,500 kg (Three 16) / 4,000 kg (Three 20) / 4,500 kg (Three 26) |
| Transport System | EXOS 10/26 |
|---|---|
| Working width | 50-630 mm |
| Working width (center support) | 100-630 mm |
| Passage height | +/-35 mm |
| Transport speed | 20-200 cm/min |
| Pin chain transport | 5 mm support |
| Heating System | EXOS 10/26 |
|---|---|
| Convection component (except vacuum chamber) | 100% |
| Convection heating modules | 11 top/11 bottom |
| Preheating | 9 top/9 bottom |
| Soldering zone | 2 top/2 bottom |
This product video introduces EXOS 10/26 by summarizing its general working principle and typical application scenarios.
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