PCO 1150
A manual-load Pressure Curing Oven (PCO) designed for PLP panel curing, offering reliable performance and controlled processing.
Building on our innovations in SMT solder reflow, including full-convection technology and efficient nitrogen usage, we now offer a complete family of custom pressure curing and reflow ovens designed for a wide range of pressure-based applications.
Heller provides multiple pressure curing oven models with various chamber sizes suitable for R&D environments and high-volume production, with optional cleanroom and automation configurations.
These systems maintain constant chamber pressure while heated air (or nitrogen) circulates through a convection heater module. The high-reliability fan motor moves heated air continuously across the pressure chamber to deliver uniform thermal processing.
An optional vacuum pump can be added to improve void removal. Vacuum is applied at the beginning of the curing cycle to eliminate larger voids, while smaller voids are removed later under pressure. Using both vacuum and pressure can help achieve shorter cycle times.
| Feature | PCO 1150 |
|---|---|
| Oven Size (mm) | 2,000[W] x 2,300[D] x 2,300[H] |
| Max Operating Pressure | 10 bar (145 psi) |
| Max Operating Temperature | 220⁰ C |
| Gas / Air Type | Nitrogen / CDA |
| Cleanroom Standard | Class 1000 |
| Vacuum Capability | Down to 10 Torr |
| Loading Type | Manual Loading (PLP Panel Magazine) |
| Capacity | 1 Magazine Capacity |
This product video introduces PCO Series by summarizing its general working principle and typical application scenarios.
English 
Türkçe