PCO 1300
A fully automatic pressure curing oven featuring 300 mm EFEM integration for streamlined handling.
Building on our innovations in SMT solder reflow, including full-convection technology and efficient nitrogen usage, we now offer a complete family of custom pressure curing and reflow ovens designed for a wide range of pressure-based applications.
Heller provides multiple pressure curing oven models with various chamber sizes suitable for R&D environments and high-volume production, with optional cleanroom and automation configurations.
These systems maintain constant chamber pressure while heated air (or nitrogen) circulates through a convection heater module. The high-reliability fan motor moves heated air continuously across the pressure chamber to deliver uniform thermal processing.
An optional vacuum pump can be added to improve void removal. Vacuum is applied at the beginning of the curing cycle to eliminate larger voids, while smaller voids are removed later under pressure. Using both vacuum and pressure can help achieve shorter cycle times.
| Feature | PCO 1300 |
|---|---|
| Oven Size (mm) | 2,200[W] x 2,200[D] x 2,475[H] |
| Chamber Usable Area (mm) | 560[W] x 680[D] x 480[H] |
| Max Operating Pressure | 20 bar (290 psi) |
| Max Operating Temperature | 260⁰ C |
| Nitrogen Enabled | (option) |
| Cleanroom Class 100 | (option) |
| Vacuum down to 5 Torr | (option) |
| * | Fully Automatic Loading with EFEM (300mm wafer) |
This product video introduces PCO Series by summarizing its general working principle and typical application scenarios.
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