Water-based stencil cleaner for the removal of solder pastes and SMT adhesives
VIGON SC 200
VIGON SC 200 is an MPC-based cleaning solution developed for the reliable removal of solder pastes and SMT adhesives from SMT stencils. It is also suitable for use in SMT printers for underside wiping processes and for cleaning misprinted assemblies.
Depending on the flux type, VIGON SC 200 can additionally be applied to misprints on double-sided PCBAs where one side has already been soldered.
The cleaning agent is intended for use in spray-in-air and ultrasonic cleaning systems.
This product video introduces VIGON SC 200 by summarizing its general working principle and typical application scenarios.
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