VIGON SC 202
VIGON SC 202 is a water-based cleaning solution developed for the reliable removal of solder pastes and SMT adhesives from stencils.
Based on MPC Technology, the product is also intended for cleaning double-sided misprints where one side has already been soldered.
The cleaning agent is recommended for use in spray-in-air and ultrasonic cleaning systems.
This product video introduces VIGON SC 202 by summarizing its general working principle and typical application scenarios.