Water-based stencil cleaner for the removal of solder pastes and SMT adhesives
VIGON SC 210
VIGON SC 210 is an MPC based cleaning solution developed for SMT stencils, enabling reliable removal of solder paste and SMT adhesives within a single cleaning process. It delivers optimal cleaning performance even at low operating temperatures.
Depending on the flux type, the product can also be applied for misprint cleaning. In addition, it is suitable for removing adhesives from tools, particularly dispensing needles.
The cleaning agent is intended for use in spray-in-air and ultrasonic cleaning equipment.
This product video introduces VIGON SC 210 by summarizing its general working principle and typical application scenarios.
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