Water-based cleaning agent for stencil underside wiping in printers
VIGON UC 160
VIGON UC 160 is a water-based cleaning solution developed for stencil underside wiping in SMT printers. It ensures effective removal of both lead-free and lead-based solder pastes, including the latest formulations.
This product video introduces VIGON UC 160 by summarizing its general working principle and typical application scenarios.
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