This 3D-AOI system offers full compatibility with SMT and through-hole processes, fulfilling all quality standards for sophisticated inspection tasks. It is designed to handle high-density printed circuit boards and assemblies featuring a combination of extremely small and tall components. The camera resolution and lighting configurations can be customized, ensuring the necessary flexibility for various production environments and product ranges.
Scalability
✔ Several options are available, such as dome lighting, side cameras, and Z-axis control.
✔ Conformal Coating Inspection (CCI) can be integrated through the UV lighting option.
✔ Camera resolution settings are adjustable on-site.
Optimization of the production line
✔ The creation of inspection programs is characterized by automation and efficiency.
✔ It ensures seamless coordination between SAKI devices.
High accuracy and high speed
✔ Smallest components are clearly identified through high-definition images.
✔ Inspections are executed at the quickest speed possible.
| Feature | 3Di-ZS3EX |
|---|---|
| Dimensions | XL |
| Size[Main body] (W) x (D) x (H) mm (in.) | 1840×1480×1520 (72.44 x 58.27 x 59.84) |
| Resolution | 15μm*1 |
| PCB Clearance mm (in.) | Top: 40 (1.57) Bottom: 60 (2.36) *2 |
| Electric Power Requirement | Single-phase ~ 200-240V+/-10%, 50/60Hz |
| PCB Size （W）×（L）mm (in.) | 50 x 60 – 686 x 1016 (1.97 x 2.36 – 27.00 x 40.00)*4 |
| Weight | 980kg |
| ! |
|---|
| *1 Imaging speed when equipped with a Z axis. The XL size comes standard with a Z axis. |
| *2 For dual mode, the PCB Clearance Bottom is 50mm (1.96 in.), |
| *3 For dual mode, the PCB Size is 50×60〜320×510 (1.97 x 2.36 – 12.60 x 20.07) |
| *4 An expansion to 60 inches (686 x 1524) is optional. |
This product video introduces 3Di-ZS3EX by summarizing its general working principle and typical application scenarios.
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