✔ VIGON SC 210 is an MPC based cleaning solution developed for SMT stencils, enabling reliable removal of solder paste and SMT adhesives within a single cleaning process. It delivers optimal cleaning performance even at low operating temperatures.
✔ Depending on the flux type, the product can also be applied for misprint cleaning. In addition, it is suitable for removing adhesives from tools, particularly dispensing needles.
✔ The cleaning agent is intended for use in spray-in-air and ultrasonic cleaning equipment.
This product video introduces VIGON SC 210 by summarizing its general working principle and typical application scenarios.
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