The stackable dotting process enables the creation of high-profile adhesive dots, ensuring components are firmly bonded to the PCB. Unlike conventional SMT dispensers, it eliminates any tailing effect, delivering cleaner and more reliable results.

By jetting glue lines between PTH leads with narrow pitch, such as those found in connectors and sockets, the system effectively prevents solder bridging during the wave soldering process.

The D-Sniper SMT dispenser enables corner bonding applications within a single SMT reflow process without requiring additional investment. Before placing the BGA, SMA adhesive is dispensed onto the PCB corners of the BGA area. Unlike traditional contact dispensing, which cannot create the specific shapes and patterns required for corner bonding, this method delivers extra shock and bending resistance to the assembly during the reflow process.
(Photo Credits: Henkel AG & Co. KGaA)

Designed to shield components from dust, vibration, moisture, and harsh environmental factors, ensuring the maximum operational lifespan of electronic devices. Without the need for extra investment in a traditional spray coating system, the D-Sniper can be transformed into a jet coating machine.

By dispensing the right amount of material (with the smallest mark at 0.3 mm), components are kept strong and securely attached. The optional Precision Material Weight Calibration System guarantees a consistent volume of underfill material is applied to every component.

The D Series machine is capable of dispensing red glue dots for mixed-technology PCB bottom-side assembly, enhancing the mechanical bonding strength. With an accuracy of CPK >1.33, the dispensing speed can reach up to 1000 mm per second.

Equipped with a built-in turning unit, the system allows the nozzle to rotate, enabling precise angular position dispensing for advanced applications.

The Dual Valve system enables simultaneous dispensing supported by Active Correction Technology (ACT). With ACT, the second valve can be adjusted along the Y-axis for improved dispensing precision. It also allows independent dispensing of different materials, making it highly beneficial in automated and high-mix production environments.

With a dual-lane design, the system significantly reduces process time and boosts throughput performance. This capability is especially valuable in automated and high-mix production environments.