Two machines set up back-to-back are the perfect solution for a dual-lane SMT production line. The GL-Star’s internal structure is pre-assembled in a back-to-back configuration, allowing it to function as a standalone unit or to be seamlessly expanded with additional equipment in the future.

The stencil Y-axis position can be easily adjusted through the user interface, with settings that can be saved and reused when replacing the stencil. This feature helps to minimize human errors and greatly reduces the time needed for repositioning.

The stencil lock with vacuum suction secures the stencil tightly on both sides of the conveyor during the printing cycle. By maintaining firm contact with the PCB, it completely eliminates stencil vibration, ensuring stable and precise printing.

The PCB clamper, designed and patented by GKG, combines a retractable top clamp with a motor-driven side clamp. With these standard functions, even the most demanding substrates can be firmly secured, ensuring stable clamping and top-quality printing results.

With the ability to automatically upload machine status and parameters, the GL-Star is designed to support the shift towards Industry 4.0 smart manufacturing. It provides seamless integration with MES systems, improving both product traceability and maintenance efficiency.

With the SPI closed-loop system, the machine automatically adjusts and corrects print deposits based on feedback regarding insufficient print quality. This creates a complete printing feedback loop, improving both print accuracy and overall production efficiency.

This SMT printer tracks the solder paste rolling diameter in real time and automatically triggers dispensing whenever it drops below 10 mm. It eliminates insufficient paste on the stencil and maintains the paste rolling speed within the optimal range, ensuring the best possible printing results.

The solder paste is automatically dispensed along the full length of the squeegee, maintaining a 15 mm rolling diameter and using a standard 500 g solder paste container. This process eliminates solder paste waste caused by overflow at the squeegee edges.

By using a panel light on the top and a CCD camera underneath, the system inspects stencil apertures with precision. It automatically detects clogged apertures, preventing the use of defective stencils and guaranteeing high-quality printing from the very first run.