A 2D bottom-side inspection machine is engineered to automate the final inspection stages of PCB mounting. This Bottom-Side AOI system ensures the solder quality of through-hole components following selective, flow, and dip soldering processes. Since manual board handling and PCB reversal are no longer required, operational efficiency is significantly enhanced.
✔ Efficiency
The equipment design is optimized to accommodate the mounting of large components.
✔ Common operations with SMT process
✔ High-speed Inspection
-Full-board imaging enables rapid inspection across the entire assembly. This is achieved through SAKI’s specialized line scan imaging method.
✔ Solder Detection
THT solder inspection identifies various solder defects concurrently. The system also features Extra Component Detection (ECD) inspection capability.
| Feature | 2Di-LU1 |
|---|---|
| Size (W)×(D)×(H)mm (in.) | 1040×1440×1500 (40.94 x 56.69 x 59.06) |
| Resolution | 18μm |
| PCB Clearance | Top: 130mm (1.57 in.) Bottom: 40mm (2.36 in.) |
| Electric Power Requirement | Single-phase ~ 200-240V +/-10%, 50/60Hz, 700VA |
| Weight | Aprox. 750kg |
| PCB Size (W)×(L)mm (in.) | Carrier：50 x 60 – 610 x 610 (1.97 x 2.36 – 24.02 x 24.02) Inspection area (Scan)：50 x 60 – 460 x 500 (1.97 x 2.36 – 18.11 x 19.69) |
| PCB Weight | 12kg or less |
This product video introduces 2Di-LU1 by summarizing its general working principle and typical application scenarios.
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