An AI intelligent denoising feature is integrated into the system to restore objective and real solder paste imaging. The specifically developed light source scheme allows the SPI to adapt to PCB pads of various colors and materials, which enhances the overall imaging accuracy.

The equipment features AI intelligent programming, enabling the generation of the entire board image with a single click. By using intelligent configuration parameters, the process does not rely on engineer experience, ensuring higher levels of program consistency.

By integrating the control data of SPI, pre-furnace AOI, and post-furnace AOI, the system facilitates the rapid analysis of product defects. This integration helps to locate the root cause, improve the status of defective products, and increase the yield of the production line.