The EXOS 10/26 is designed to meet the requirements of electronics manufacturing for non-porous solder joints, particularly in power electronics and high-reliability applications. This convection reflow soldering system features 22 heating chambers, 4 cooling zones, and a vacuum chamber positioned after the peak zone, enabling the void rate to be reduced by up to 99%.
With its intelligent features, the EXOS 10/26 supports highly economical production while enabling “void-free” soldering performance.
| Feature | EXOS 10/26 |
|---|---|
| Length | 7,875 mm |
| Width | 2,195 mm |
| Height | 1,969 mm |
| Weight with options | 5,000 kg |
| Feature | EXOS 10/26 |
|---|---|
| Working width | 50-630 mm |
| Working width (center support) | 100-630 mm |
| Passage height | +/-35 mm |
| Transport speed | 20-200 cm/min |
| Pin chain transport | 5 mm support |
| Feature | EXOS 10/26 |
|---|---|
| Inlet | 1,011 mm |
| Heating zone | 4,545.5 mm |
| Vacuum zone | 558 mm |
| Cooling zone | 1,536 mm |
| Outlet | 730 mm |
| Feature | EXOS 10/26 |
|---|---|
| Convection component (except vacuum chamber) | 100% |
| Convection heating modules | 11 top/11 bottom |
| Preheating | 9 top/9 bottom |
| Soldering zone | 2 top/2 bottom |
This product video introduces EXOS 10/26 by summarizing its general working principle and typical application scenarios.
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