Characterized by a flexible and constantly monitored process, the Firefly Line addresses diverse manufacturing needs through clean, efficient laser technology.

Seamless Line Integration through System Modularity
The modularity of Firefly systems ensures enhanced integration into existing production lines. Depending on specific production requirements, both top and bottom soldering modules can be deployed.

Advanced Motion and Power Control via VIVA Software
Extensive experience achieved in flying probe test systems enabled the successful integration of VIVA software, providing complete management of soldering alloy distribution motion alongside precise power transfer control. This development establishes a line of systems engineered to resolve process automation challenges.

Ideal Solution for Board Manufacturers and Sub-Contractors
High repeatability and operational flexibility make the Fireflysystem an ideal choice for both electronic board manufacturers and sub-contractors.

The Technical Advantages of Laser Technology
- The technology allows point-by-point adjustment of the power required for soldering.
- The total lack of thermal inertia in the laser, combined with real-time temperature readings, enables dynamic correction of the thermal profile.
- The technology allows point-by-point adjustment of the power required for soldering.
- The total lack of thermal inertia in the laser, combined with real-time temperature readings, enables dynamic correction of the thermal profile.
- An orthogonal positioning structure improves the efficiency of energy transfer. Furthermore, the specialized donut beam radiates energy exclusively onto the pad rather than the hole, preventing damage to sensitive components while harmonizing the temperature between the pin and pad.
- The capacity to apply all thermal energy into a single point makes this technology highly applicable in situations where heating the entire board is impermissible or where access is limited.
- Transitioning from "Lead" to "Lead-Free" soldering operations is simplified, requiring only a straightforward change of the solder wire spool.
- The laser soldering process is inherently clean, eliminating any need to clean or subsequently handle processed boards. Additionally, the power consumption of Firefly remains extremely low compared to alternative soldering technologies.
- Firefly systems are fully ready to solder immediately upon being switched on without requiring preheating, serving as an extremely flexible tool within a manufacturing environment.

Diverse Solutions for Varied Production Needs
The core of the system is the soldering head, which remains common to both Firefly B60 and Firefly T60 machine configurations. These two options are characterized mainly by the specific side of the board where processing is performed: the BOTTOM solution, where the soldering process is carried out from below the PCB, and the TOP solution, where the soldering process is executed from above the printed circuit board. This particular configuration is highly suitable for automated processes where the system is integrated directly into an existing conveyor line. Firefly soldering systems can be successfully integrated into high-volume production lines, as well as environments where the products to be soldered change continuously and "Lead" and "Lead-free" processes are frequently mixed.

Comprehensive Process Traceability
Process traceability is fully ensured by the ability to collect video recordings and thermal profiles acquired for every individual solder joint, associating this data directly with the serial number of the printed circuit board. The collection of these parameters is also valuable as a dedicated debug tool for the soldering process.

Environment-Friendly Operation
With a maximum power absorption of 2.5 KW/h, the Firefly is easy to manage and maintain. Furthermore, the utilization of flux-based soldering alloys eliminates any need for external fluxing stations or nitrogen. The consumption of solder alloy is strictly limited to the precise amount applied to each individual joint, generating zero waste and completely eliminating disposal costs.