POWERFLOW
High-performance Powerflow wave soldering system with an Attractive Price-Performance Ratio
Modular and flexible preheating concept, individually expandable and variably configurable in length and power (Retrofit Possible)
Monitoring and documentation of all process-relevant data, ensuring readiness for traceability
| Technical Specification | POWERFLOW ULTRA |
|---|---|
| Length | from 4,200 to 4,950 mm |
| Width | approx. 1,515 mm |
| Height | approx. 1,565 mm |
| Transport System | POWERFLOW ULTRA |
|---|---|
| Transport Type | Finger transport |
| Max. Transport speed | 2.5 m/min |
| Max. Working width | 508 mm |
| Max. PCB structures up to | 120 mm |
| Preheating/Soldering Module | POWERFLOW ULTRA |
|---|---|
| Bottom preheating | Short-wave radiator cassette, dynamic - max. 10.4 kW (power adjusted), Medium-wave radiator cassette, max. 6 kW (regulated), Dimensions: 600 mm length each |
| Soldering module | Power approx. 9.8 kW, Solder content: approx. 820 kg lead-free alloy, Solder temperature: max. 300 °C |
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