The Zestron Resin Test visually and temporarily identifies the local distribution of resin based residues on electronic assemblies via a color reaction.

Critical resin residues, which cause poor adhesion of conformal coatings and delamination effects can be localized during the production and removed by a cleaning step.

Thus the critical resin amount of <40 μg/cm² (258.06 μg/sq in) according to J-STD 001 can be met. 

This test complements analytical methods such as Ionic Contamination Measurement and the Zestron Flux Test (detection of activators/acids).