The SAKI 3D-SPI facilitates enhanced production efficiency through exceptional speed, alongside improved product performance and precise takt-time control. This system is fully compatible with SMT and through-hole processes, meeting rigorous quality standards for complex inspection tasks, including high-density printed circuit boards and boards containing a combination of miniature and tall components.
3D-SPI
✔ High-accuracy, high-quality, and versatile solder print inspection.
✔ The fastest inline inspection speed available in the industry.
✔ M2M collaboration designed to achieve comprehensive line automation.
3D-AOI
✔ Inspection characterized by high precision and high speed.
✔ Optimized work efficiency regarding the creation of inspection programs.
✔ AI solutions implemented to reduce dependency on operator skill levels.
Advanced Software Solutions
✔ A unified user interface integrated across SPI, AOI, and AXI platforms.
✔ Improved operational efficiency for developing inspection programs.
✔ Production enhancement through AI solutions that refine inspection quality.
| Feature | 3Si-LS3GX |
|---|---|
| Dimensions | L |
| Size[Main body] (W) x (D) x (H) mm (in.) | 1040×1280×1500 (40.95 x 50.39 x 59.06) |
| Resolution | 15μm |
| PCB Clearance mm (in.) | Top: 40 (1.57) Bottom: 60 (2.36) |
| Electric Power Requirement | Single-phase ~ 200-240V+/-10%, 50/60Hz |
| PCB Size （W）×（L）mm (in.) | 50 x 60 – 510 x 510 (1.97 x 2.36 – 20.07 x 20.07) |
This product video introduces 3Si-LS3GX by summarizing its general working principle and typical application scenarios.
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