The system features a professional multi-color integral light source that utilizes different angles of RGB light source irradiation. This technique accurately reflects the slope information of the object's surface, making the solder joint layer more obvious and clearly showing solder defects during the control process.

Based on big data and AI deep learning algorithm training, the equipment covers more than 97% of solder joint models. This allows for the automatic identification of solder joints across the entire board and enables the configuration of detection algorithms to automatically adjust parameters.

The model, developed through big data training, can correct alarms caused by the diversified deviation of solder joints. It effectively addresses issues such as missing or false alarms resulting from large variations in solder joint components or the influence of pins and devices.