R-0925-SLX 9 Channel Profiler
The R‑0925‑SLX provides expanded thermal visibility for complex, multi‑layer and high‑density PCB designs. With 9 Type‑K channels, compact SmartLink architecture and robust thermal protection, it delivers the deeper insight required for today’s demanding reflow processes — all in a slim, production‑friendly form factor.
Precision Thermal Measurement Through a Smart, Compact Workflow The R‑0925‑SLX combines smart hardware and powerful software to simplify advanced profiling.
SmartLink Modular Datalogger : The SLX datalogger connects to the heatshield and thermocouple adapter using the SmartLink system, enabling 9 independent Type-K channels without increasing the profiler’s width. This allows detailed thermal capture while maintaining compatibility with tight conveyor clearances.
High-Temperature Heatshield Protection: A stainless-steel heatshield (HS-SL2580-SL9) protects the datalogger during exposure to elevated reflow temperatures, with defined survival durations at 100°C, 150°C, 200°C and 250°C.
Accurate Profiling & Onboard Memory : Profiles are recorded with ±0.5°C accuracy and stored in 12 onboard memories, supporting rapid setup, repeatable verification and easy comparison between runs.
Software for Analysis & SPC : Data is transferred via USB or optional 2.4 GHz wireless. The software suite provides profile analysis, SPC charting, simulation tools and libraries for oven and solder paste specifications.
Solderstar’s integrated platform brings the SLX datalogger, process-specific hardware, and advanced analysis software together in one streamlined system, giving manufacturers a seamless workflow from data capture to insight. With everything designed to work as a single environment, it removes compatibility headaches, speeds up decision-making, reduces operator training to virtually zero, and delivers consistent, standardised process control across every production line.
Solderstar’s Reflow Approach
Solderstar recognises the importance of reflow profiling for both process and product quality.
Capture An Accurate Initial PRODUCT Profile
Connect a test PCB to the heatshield and dock the SLX datalogger. Power up the SLX and close the heatshield, then pass it through the reflow process to record an initial product profile baseline.
Optimize to produce PRODUCT Profile Baseline Settings
Produce optimized product baseline settings using Profile Central’s Auto-Seeker Profile Optimization tool. Enter the optimized product profile settings into the reflow oven and allow it to stabilise.
Record and then check the PROCESS Profile
Pass ReflowShuttle through the process to initially record a process profile, then periodically to check the profile for stability while using built-in SPC software tools to check process mean and variance.
The benefits of the Solderstar Reflow System
Solderstar solutions are designed specifically to improve measurement, setup, and ongoing control of the reflow process.
Accurate Profiling of PCB Temperatures Across Multiple Points
✔ Allowing for an improved first-pass yield.
Fast Setup and Optimisation
✔ Providing clear data feedback and reducing the potential for defects and reworks.
Verification against process limits
✔ Allowing for faster product changeovers.
User-friendly software
✔ Designed to simplify complex variable data into actionable insights, providing greater confidence in process stability.
The R‑0925‑SLX is engineered to give manufacturers deeper thermal visibility through a combination of expanded measurement capability, compact SmartLink architecture, and robust high‑temperature protection.
Nine Type-K Measurement Channels
Expanded thermal visibility for complex, high-density, and multi-layer PCB assemblies.
Compact SLX Datalogger
Ultra-slim 126 mm × 52 mm × 9.5 mm design, maintaining the same width as the standard SLX platform.
High-Temperature Heatshield
Stainless-steel construction with 9 Type-K sockets, engineered for extended survival at elevated temperatures.
USB or 2.4 GHz Wireless Telemetry
Flexible data transfer options, including real-time wireless monitoring via 2.4 GHz telemetry.
Automatic Sensor Detection
Built-in diagnostics verify thermocouple integrity before each run.
Probably the most important part of a profiling system is its software. The software allows process data to be captured, stored, organised, and analysed to determine the current process state.
Modern profiling software offers much more than this though, incorporating sophisticated process recipe search engines which allow a process to be optimised for maximum quality and throughput. SPC tools allow engineers to track process stability and warn when corrective action needs to be taken.
Solderstar software has a modern look and feel. Important data is displayed in an easy-to-understand form that process operatives and engineers alike feel comfortable with.
Solderstar’s integrated platform brings the SLX datalogger, process‑specific hardware, and advanced analysis software together in one streamlined system, giving manufacturers a seamless workflow from data capture to insight. With everything designed to work as a single environment, it removes compatibility headaches, speeds up decision‑making, reduces operator training to virtually zero, and delivers consistent, standardised process control across every production line.
The R‑0925‑SLX is engineered for manufacturers working with increasingly sophisticated assemblies. Its 9-channel capability allows engineers to monitor more locations simultaneously, capturing the thermal behaviour of dense component clusters, large BGAs, power devices, and multi‑layer structures in a single pass. This expanded visibility helps identify subtle thermal variations that can impact solder quality, reliability, and long‑term product performance.
Despite the increased channel count, the profiler retains the same compact width as the standard SLX platform, ensuring smooth travel through tight reflow environments. Combined with its robust heatshield and powerful software suite, the R‑0925‑SLX provides a complete solution for process setup, optimisation, and long‑term verification. Engineers gain the tools needed to validate reflow profiles quickly, maintain stable processes, and respond confidently to the challenges of modern electronics manufacturing.
| Feature | SLX Datalogger |
|---|---|
| Size/Weight | 126mm x 52mm x 9.5mm, 118g |
| Channels | Support for upto 12 - Type K |
| Temperature Memory | 12 Memories, each with 25000 data points per measurement channel |
| Measurement Rate | 0.05s to 60 seconds |
| Measurement Range | -125 to 1372°C (-257 to 2502 °F) |
| Measurement Accuracy | ±0.5 °C (0.9°F) |
| Measurement Resolution | ±0.05 °C (0.09°F) |
| Max. Internal Temperature | +85 °C (Auto Shutdown on over temp.) |
| Power | User replaceable, High Temperature NiMH |
| Communications | USB or optional 2.4Ghz Wireless |
| Input Type | Type K, EN 05842:1993, Class 1 / ANSI MC 96.1 |
| Model | HS-SL2580-SL9 |
|---|---|
| Material | Stainless Steel construction |
| Sensors | 9 x Type-K standard socket inputs |
| Shield Size (L x W x H) | 310mm x 80mm x 25mm |
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