CompaCLEAN III

The CompaCLEAN III is designed for customers who prefer a traditional dishwasher-style cleaning system. It delivers a familiar cleaning approach while reducing the shadow effect through its unique linear tangent spray technology. PCBs are loaded in a manner similar to placing plates in a standard kitchen dishwasher.

  • Application: Standard SMD Assemblies
  • Capacity: Medium Volume
  • Contamination Solubility: Easy to Moderate
Technical Features of CompaCLEAN III
Cleaning Machines Overview CompaCLEAN III
Usable chamber size: W x L x H [mm] (W=left-right, L=front back, H=height) 480 x 500 x 500
Usable space for standard clamping: W x L x H [mm](W=left right, L=front back, H=height) 430 x 490 x 500 or 430 x 490 x 2 x 200
PCBA, HDI, DC, BGA, PoP, SIP CSP, BTC, QFN, MELF hybrids, etc.
Eurocards (100 x 160 mm) [pcs per cycle] 140
Cycle time [minute] 30 - 60
Metal & Plastic stencils (paste, glue) X
Stencils [pcs per cycle] X
Cycle time [minutes] X
Maintenance parts from soldering process (solder pallets, filters, carrier, etc.)
Solder pallets [pcs per cycle] 500 x 500 x 40 mm (other sizes optional) 6
Cycle time [minute] 20-40
Cleaning agent volume (Ready-to-use) 71 L
Max. cleaning temperature 60°C
Max. rinsing temperature 40°C
Max. drying temperature 110°C
Machine dimensions W x L x H [mm] (W=left-right, L= front-back, H = height) * height with opened door 1100 x 1700 x 2220
Machine weight without liquid 455 - 485 kg
Product Brochure of CompaCLEAN III

Download the product brochure of CompaCLEAN III to learn about its key features, technical structure, and application areas.

Product Video
CompaCLEAN III

This product video introduces CompaCLEAN III by summarizing its general working principle and typical application scenarios.

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