HyperSWASH III

Top-end solution designed for customers seeking high-quality cleaning results together with high throughput performance, with a strong emphasis on data management and automation. The system is engineered to deliver maximum data output while requiring minimal human interaction.

  • Application: High Density & Standard SMD Assemblies
  • Capacity: High Volume
  • Contamination Solubility: Easy to Hard
Technical Features of HyperSWASH III
Cleaning Machines Overview Twingo Combo
Usable chamber size: W x L x H [mm] (W=left-right, L=front back, H=height) 2 x 890 x 80 x 850 2 x 890 x 315 x 300 or 3 x 890 x 315 x 170
Usable space for standard clamping: W x L x H [mm](W=left right, L=front back, H=height) 2 x 740 x 80 x 695 2 x 788 x 728 x 300 or 3 x 788 x 278 x 165
PCBA, HDI, DC, BGA, PoP, SIP CSP, BTC, QFN, MELF hybrids, etc.
Eurocards (100 x 160 mm) [pcs per cycle] 40 112/168
Cycle time [minute] 20-40 20-40
Metal & Plastic stencils (paste, glue)
Stencils [pcs per cycle] 2
Cycle time [minutes] 7
Maintenance parts from soldering process (solder pallets, filters, carrier, etc.)
Solder pallets [pcs per cycle] 500 x 500 x 40 mm (other sizes optional)
Cycle time [minute]
Cleaning agent volume (Ready-to-use) 80L 80L
Max. cleaning temperature 60°C 60°C
Max. rinsing temperature 40°C 40°C
Max. drying temperature 110°C 110°C
Machine dimensions W x L x H [mm] (W=left-right, L= front-back, H = height) * height with opened door 2010 x 2075 x 2615 2010 x 2075 x 2615
Machine weight without liquid 1000 KG 1000 KG
Product Brochure of HyperSWASH III

Download the product brochure of HyperSWASH III to learn about its key features, technical structure, and application areas.

Product Video
HyperSWASH III

This product video introduces HyperSWASH III by summarizing its general working principle and typical application scenarios.

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